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Better Thermal Management and Smaller Footprint in a Thermal Substrate Precision Thin / Thick Film Metallized Substrate

DBC(Direct Bond Copper) Substrate and DPC(Direct Plated Copper) Substrate.
Since 1930, DBC(Direct Bonded Copper) substrate and DPC(Direct Plated Copper) substrate have been the main methods for making electrically conductive interconnects on insulating substrates.

DBC(Direct Bonded Copper) Substrate

DBC means Direct Bonded Copper and denotes a process in which copper and a ceramic material are directly bonded. Direct bonded copper substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of high power semiconductor modules. The advantages of DBC substrates are high current carrying capability due to thick copper metallization and a thermal expansion close to the silicon at the copper surface due to high bond strength of copper to ceramic.

Normally, DBC has two layers of copper that are directly bonded onto an aluminum-oxide (Al2O3) or aluminum-nitride (AlN) ceramic base. The DBC process yields a super-thin base and eliminates the need for the thick, heavy copper bases that were used prior to this process. Because power modules with DBC bases have fewer layers, they have much lower thermal resistance values. And because the expansion coefficient matches silicon, they have much better power cycling capabilities (up to 50,000 cycles).
Disadvantage of DBC(Direct Bonded Copper)

The drawback of standard DBC substrates for high voltage applications is a start of partial discharge at relatively low voltages. Therefore another kind of substrates using expensive metal brazing technologies

is mainly used in high voltage semiconductor modules for traction applications. The initiation voltage for ceramic thickness of 0.63mm is less than 4 kV. Main causes for this behavior are small voids between copper and ceramic and blurred straight border lines of the copper conductors at the copper/ceramic interface. The new DBC process and an improved etching technology are eliminating these disadvantages. The other disadvantage of DBC is its deficiency for thermal shock because of the very large residual stress on the substrate surface due to the CTE mismatch of alumina and copper.

The newly developed DBC technologies of the liquid cooled and the partial discharge free substrates have a great potential to expand further application fields of DBC substrates as well as high power semiconductor modules in the near future. more detail please visit website. http://metallized-ceramic.ready-online.com

Tong Hsing's more than 30-years of experience can ensure your product is made based on design. That is - satisfaction is guaranteed.
Tong Hsing Electronic Industries Limited is a world leader that has been specialized in providing micro module foundry services since 1975. Tong Hsing has held to the principle of providing the best solutions for the company and its customers, devoting their energies to becoming the best business partner of their customers by offering substantial benefits in the form of competitive pricing, timely delivery and quality products. Their strategic plan is to provide state-of-the-art microelectronic packaging technology to various industries manufacturing wireless communications, sensors, fiber optics, LED, automotive electronics, computer peripherals, medical and network equipment.

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Tong Hsing Electronic Industries Limited is a world leader that has been specialized in providing micro module foundry services since 1975. Tong Hsing has held to the principle of providing the best solutions for the company and its customers, devoting their energies to becoming the best business partner of their customers by offering substantial benefits in the form of competitive pricing, timely delivery and quality products. Their strategic plan is to provide state-of-the-art microelectronic packaging technology to various industries manufacturing wireless communications, sensors, fiber optics, LED, automotive electronics, computer peripherals, medical and network equipment.

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